| 翻訳と辞書 |
| Semiconductor-die cutting ： ウィキペディア英語版 |
Die preparation
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.
== Wafer mounting ==
Wafer mounting is a step that is performed during the die preparation of a wafer as part of the process of semiconductor fabrication. During this step, the wafer is mounted on a plastic tape that is attached to a ring. Wafer mounting is performed right before the wafer is cut into separate dies. The adhesive film on which the wafer is mounted ensures that the individual dies remain firmly in place during 'dicing', as the process of cutting the wafer is called.
The picture on the right shows a 300 mm wafer after it was mounted and diced. The blue plastic is the adhesive tape. The wafer is the round disc in the middle. In this case, a large number of dies were already removed.
抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』
■ウィキペディアで「Die preparation」の詳細全文を読む
スポンサード リンク
| 翻訳と辞書 : 翻訳のためのインターネットリソース |
Copyright(C) kotoba.ne.jp 1997-2016. All Rights Reserved.
|
|